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LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only
ROUND TYPE LED LAMPS
LSBK3330S
DATA SHEET
DOC. NO : REV. DATE : :
QW0905-LSBK3330S A 07 - Dec - 2004
LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only
PART NO. LSBK3330S Page 1/4
Package Dimensions
5.0
5.9
7.6
8.6
1.5MAX 25.0MIN
1/4
0.5 TYP 1.0MIN 2.54TYP
Note : 1.All dimension are in millimeter tolerance is O 0.25mm unless otherwise noted. 2.Specifications are subject to change without notice.
Directivity Radiation
0X -30X 30X
-60X
60X
100% 75% 50%
25%
0
25% 50% 75% 100%
LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only
PART NO. LSBK3330S Page 2/4
Absolute Maximum Ratings at Ta=25 J
Ratings Parameter Symbol SBKS Forward Current Peak Forward Current Duty 1/10@10KHz Power Dissipation Reverse Current @5V Electrostatic Discharge Operating Temperature Storage Temperature Soldering Temperature IF IFP PD Ir ESD Topr Tstg Tsol 30 100 120 50 150 -20 ~ +80 -30 ~ +100 Max 260J for 5 sec Max (2mm from body) mA mA mW UNIT
g A V J J
Typical Electrical & Optical Characteristics (Ta=25 J )
COLOR PART NO MATERIAL Emitted
LSBK3330S
Forward Dominant Spectral voltage wave halfwidth length f nm @20mA(V) f Dnm
Luminous intensity
@20mA(mcd)
Viewing angle 2c 1/2 (deg)
Lens
Blue Diffused
Typ. Max. Min. 475 26 3.5 4.2 50
Typ. 120 34
InGaN/SiC
Blue
Note : 1.The forward voltage data did not including O 0.1V testing tolerance. 2. The luminous intensity data did not including O 15% testing tolerance.
LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only
PART NO. LSBK3330S Page 3/4
Typical Electro-Optical Characteristics Curve
SBK CHIP
Fig.1 Forward current vs. Forward Voltage
30 25 20 15 10 5 0 1 2 3 4 5
Fig.2 Relative Intensity vs. Forward Current
Forward Current(mA)
1.5
Relative Intensity Normalize @20mA
1.25 1.0 0.75 0.5 0.25 0 0 5 10 15 20 25 30
Forward Voltage(V)
Forward Current(mA)
Fig.3 Forward Current vs. Temperature
Fig.4 Relative Intensity vs. Wavelength
Forward Current@20mA
30 20 10 0 0 25 50 75 100
Relative Intensity@20mA
40
1.0
0.5
0 380
430
480
530
580
630
680
Ambient Temperature(J )
Wavelength (nm)
LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only
PART NO. LSBK3330S Page 4/4
Reliability Test:
Test Item
Test Condition
1.Under Room Temperature 2.If=20mA 3.t=1000 hrs (-24hrs, +72hrs)
Description
This test is conducted for the purpose of detemining the resisance of a part in electrical and themal stressed.
Reference Standard
MIL-STD-750: 1026 MIL-STD-883: 1005 JIS C 7021: B-1
Operating Life Test
High Temperature Storage Test
1.Ta=105 JO 5J 2.t=1000 hrs (-24hrs, +72hrs)
The purpose of this is the resistance of the device which is laid under ondition of hogh temperature for hours.
MIL-STD-883:1008 JIS C 7021: B-10
Low Temperature Storage Test
1.Ta=-40 JO 5J 2.t=1000 hrs (-24hrs, +72hrs)
The purpose of this is the resistance of the device which is laid under condition of low temperature for hours.
JIS C 7021: B-12
High Temperature High Humidity Test
1.Ta=65 JO 5J 2.RH=90 %~95% 3.t=240hrs O 2hrs
The purpose of this test is the resistance of the device under tropical for hous.
MIL-STD-202:103B JIS C 7021: B-11
Thermal Shock Test
1.Ta=105 JO 5J &-40JO (10min) (10min) 2.total 10 cycles
5J
The purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. This test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire.
MIL-STD-202: 107D MIL-STD-750: 1051 MIL-STD-883: 1011
Solder Resistance Test
1.T.Sol=260 JO 5J 2.Dwell time= 10 O 1sec.
MIL-STD-202: 210A MIL-STD-750: 2031 JIS C 7021: A-1
Solderability Test
1.T.Sol=230 JO 5J 2.Dwell time=5 O 1sec
This test intended to see soldering well performed or not.
MIL-STD-202: 208D MIL-STD-750: 2026 MIL-STD-883: 2003 JIS C 7021: A-2

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